Description
The new SIM HST3000-BDCM-WB2-2 for modem plus wideband copper testing.
Broadcom Chipset Bonded SIM With 2mm XDSL Support
The new SIM has the improvement in that the 2mm copper interface connectors at the top of the SIM can be used for both copper testing and xDSL testing. With the new SIM, the user has the configuration choice of xDSL testing on either the 8-pin RJ-45 connector on the side of the SIM, or the 2mm Copper connectors on the top of the SIM. For the highest degree of accuracy in high bit rate or sensitive environments, JDSU recommends using the RJ-45 interface to RJ-45 interface cable, as the clip leads may introduce variability.
HST3000-BDCM-WB2 ADSL/VDSL Bonded and Copper (up to 30 MHz) with Broadcom Chipset
Saves money an reduces repeat faults with triple-play services testing capability in one Universal xDSL module that covers ADSL1, ADSL2, ADSL2+, VDSL2, Bonded ADSL, and Bonded VDSL
Provides critical ability to verify correct pair-bonding and provisioning
Provides investment protection in both CPE and DSLAM equipment, featuring the lates Broadcom chipset and compatible with the widest range of chipset manufacturers (Broadcom, Infineon, Ikanos/Conexant, and Texas Instruments)
Reduces troubleshooting time enabling users to segment single line performance issues of a bonded group and segment which pair requires further troubleshooting
Provides Hlog, and QLN graphing, which are key for identifying bridged tap, noise, and pair balance problems
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